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> DIAGRAM Sn-Pb Alloy Phase
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(+6221) 5595.0744
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Pure tin melts at 232 °C and the melting point of pure lead is 327 °C. When elements are combined, the melting point of the solder formed can be below that of either pure metal. A composition of 63/37% melts at 183, which represents the lowest melting point and most rapid transition from the solid to the liquid state of other tin-lead ratio. The 63/37% solder is termed the eutectic composition. All solder, with the exception of the eutectic compo-sition, which melts sharply from solid to liquid, passes through a stage of softe-ning between its solid and liquid stages known as the PASTY range. A fusion diagram showing the temperature ranges for the various states of solder for all tin-lead combination.
| Class / Nature | Solid Phase | Liquid Phase | Specific Gravity | Strength of tens. Kg/mm | Hardness | Conductivity Cu: 100% |
Sn 63 / |
183.3 |
183 - 187 |
8.3 - 8.5 |
5.4 |
17 |
11.9 |
60/40 |
183.3 |
186 - 195 |
8.4 - 8.6 |
5.3 |
16 |
11.6 |
55/45 |
183.3 |
198 - 207 |
8.6 - 8.8 |
4.5 |
16 |
11.1 |
53/47 |
183.3 |
203 - 212 |
8.7 - 8.9 |
4.3 |
16 |
10.9 |
50/50 |
183.3 |
210 - 219 |
8.8 - 9.0 |
4.1 |
14 |
10.7 |
45/55 |
183.3 |
222 - 231 |
9.0 - 9.2 |
3.9 |
13 |
10.3 |
40/60 |
183.3 |
234 - 242 |
9.2 - 9.4 |
3.8 |
13 |
9.9 |
37/63 |
183.3 |
240 - 248 |
9.3 - 9.5 |
3.7 |
12 |
9.6 |
30/70 |
183.3 |
254 - 262 |
9.6 - 9.8 |
3.6 |
12 |
9.3 |
Ag1 / 60/39 |
178 |
183 |
8.4 - 8.6 |
5.3 |
16 |
11.8 - 12.8 |
Ag2 / 60/38 |
178 |
181 |
8.4 - 8.6 |
5.3 |
16 |
12.0 - 12.2 |